Spray Technology
Eminent
The most troublesome issue in the etching of printed circuit boards is the pooling of liquid on the top surface of the board. Various companies employ different methods to address this problem. Our company has resolved this issue with our unique "Eminent method," which combines improved quality, ease of maintenance, and stable transport of thin boards.
Eminent Method
Vertical discharge flow tends to slow down liquid exchange as etching progresses, resulting in slower vertical etching and increased side etching. In contrast, horizontal discharge flow generates vortices within the cavity, enabling quick liquid exchange. This ensures smooth liquid exchange even as etching progresses, preventing hindrance to vertical etching and thus minimizing side etching.
In the case of vertical spray,
1. Form a short cavity
2. Etching occurs from both sides due to the formation of two vortices.
3. The vortices on both sides remain stable, resulting in significant side etching.3. The vortices on both sides remain stable, resulting in significant side etching.
In the case of the Eminent method,
1. Form a short cavity
2. Etching begins from the direction of progression.
3. The vortex forms an ellipse, resulting in minimal side etching.
By preventing the diffusion of liquid in the forward and backward directions of the board flow and creating a forced liquid flow, we have eliminated liquid pooling on the top surface of the board and improved uniformity.
Eminent Series New Generation Etching Equipment
EminentⅢ
Since the launch of the Eminent Series with fixed shower pipes, we have continuously made improvements aimed at enhancing performance.
We are pleased to announce the addition of the "Eminent III," a new generation of equipment in the Eminent Series, to our lineup.
Improvement of UniformityCompared to our demo machine (Chemical: Copper(II) chloride)
By improving the liquid flow on the workpiece surface, uniformity is enhanced by approximately 4%, contributing to better quality and stability.
| EminentⅡ | EminentⅢ | |
|---|---|---|
| Etching Time | 75 sec | 58 sec |
| Spray Pressure | 0.18 Mpa | 0.18 MPa |
| Deviation | 1.01 μm | 0.56 μm |
| Range | 4 μm | 2.8 μm |
Improvement of Etch RateCompared to our demo machine (Chemical: Copper(II) chloride)
By improving the liquid volume and flow, the etch rate has increased by approximately 14%, contributing to enhanced productivity.
| Board Conditions | |
|---|---|
| Copper thickness | 18μm |
| DF thickness | 20μm |
| Substrate thickness | 0.15mm |
| L/S | 25/25μm |
| L/S Correction | None |
Improvement of Etch Factor Compared to our demo machine (Chemical: Copper(II) chloride)
The etch factor was improved by enhancing the impact force on the substrate without changing the spray pressure.
| Substrate conditions | |
|---|---|
| Copper thickness | 18μm |
| DF thickness | 15μm |
| Substrate thickness | 0.15mm |
| L/S | 30/30μm |
| L/S Correction | 40/20μm |